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Cases Involving this patent
| # | Title | Civil Action | Venue | Filing Date | Asserter Categories | Patent Asserter | Alleged Infringer |
|---|---|---|---|---|---|---|---|
| 1 | INVENSAS BONDING TECHNOLOGIES, INC. v. SAMSUNG ELECTRONICS AMERICA, INC. et al | 1:17-cv-07609 | D.N.J. |
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| # | Title | Civil Action | Venue | Filing Date | Asserter Categories | Patent Asserter | Alleged Infringer |
|---|---|---|---|---|---|---|---|
| 1 | INVENSAS BONDING TECHNOLOGIES, INC. v. SAMSUNG ELECTRONICS AMERICA, INC. et al | 1:17-cv-07609 | D.N.J. |
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